MC68302RC25C Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 132-BPGA Exposed Pad. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 8/16-Bit. Recognize operating temperatures around 0°C~70°C TA. The cpu microprocessor belongs to the M683xx series. The CPU is cored with a M68000 processor. The CPU uses DRAM RAM controllers. This microprocessor features interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI. In this CPU, I/O is set to 5.0V. The microprocessor can be searched for with MC68302 if you are looking for variants.
MC68302RC25C Features
M68000 Core

MC68302RC25C Applications
There are a lot of NXP USA Inc.
MC68302RC25C Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Package / Case	132-BPGA Exposed Pad
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	M683xx
Published	1996
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MC68302
Speed	25MHz
Core Processor	M68000
Voltage - I/O	5.0V
Number of Cores/Bus Width	1 Core 8/16-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
Additional Interfaces	GCI, IDL, ISDN, NMSI, PCM, SCPI
Co-Processors/DSP	Communications; RISC CPM
RoHS Status	ROHS3 Compliant