MPC823CZQ66B2T Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 256-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU is cored with a PowerPC processor. The CPU uses DRAM RAM controllers. This microprocessor features interfaces I2C, SMC, SCC, SPI, UART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MPC823 if you are looking for variants.
MPC823CZQ66B2T Features
PowerPC Core

MPC823CZQ66B2T Applications
There are a lot of NXP USA Inc.
MPC823CZQ66B2T Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Package / Case	256-BBGA
Operating Temperature	-40°C~95°C TA
Packaging	Tray
Series	MPC8xx
Published	1997
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC823
Speed	66MHz
Core Processor	PowerPC
Voltage - I/O	3.3V
Ethernet	10Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
USB	USB 1.x (1)
Additional Interfaces	I2C, SMC, SCC, SPI, UART
Co-Processors/DSP	Communications; RISC CPM
Display & Interface Controllers	LCD, Video
RoHS Status	Non-RoHS Compliant