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The OSD3358-512M-BSM System-In-Package (SiP) product is building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD3358-512M-BSM integrates the AM335x along with the TI TPS65217C PMIC, the TI TL5209 LDO, up to 1 Gigabyte (GB) of DDR3 Memory, a 4Kilobyte (KB)EEPROM for non-volatile configuration storage and resistors, capacitors, and inductors into a single 21mm x21mm design-in-ready package
TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, and passive components integrated into a single package
ARM®Cortex®-A8 up to 1GHz
8 channel 12-bit SAR ADC
Ethernet 10/100/1000 x 2
USB 2.0 HS OTG + PHY x2
MMC, SD, and SDIO x3
LCD Controller
SGX 3D Graphics Engine
PRU Subsystem
Access to all AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc
Automotive
Advanced driver assistance systems (ADAS)
Enterprise systems
Datacenter & enterprise computing
Personal electronics
Home theater & entertainment
| Factory Lead Time | 10 Weeks |
| Operating Temperature | 0°C~85°C |
| Series | OSD335x |
| Published | 2016 |
| Size / Dimension | 0.83 x 0.83 21mmx21mm |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Connector Type | 256-BGA |
| Speed | 1GHz |
| RAM Size | 512MB |
| Core Processor | ARM® Cortex®-A8, AM3358 |
| Module/Board Type | MPU Core |
| Co-Processor | NEON™ SIMD |
| RoHS Status | ROHS3 Compliant |
OSD3358-512M-BSM Datasheet
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