TE0803-03-2BE11-A,Trenz Electronic GmbH TE0803-03-2BE11-A price,Integrated Circuits (ICs) TE0803-03-2BE11-A Distributor,TE0803-03-2BE11-A supplier
TE0803-03-2BE11-A,Trenz Electronic GmbH TE0803-03-2BE11-A price,Integrated Circuits (ICs) TE0803-03-2BE11-A Distributor,TE0803-03-2BE11-A supplier
TE0803-03-2BE11-A
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TE0803-03-2BE11-A
    Part Number:KY-TE0803-03-2BE11-A
    Mfr. Part No:TE0803-03-2BE11-A
    Mfr.:Trenz Electronic GmbH
    Stock:10990
    Description: MPU Core Zynq UltraScale+ XCZU2EG-1SFVC784E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0803 2GB
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In Stock: 10990
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  • TE0803-03-2BE11-A Overview
    MPU Core is the type of module or board that is used in this microcontroller.Microprocessor chip is powered by a processor with a total of Zynq UltraScale+ XCZU2EG-1SFVC784E cores in it.It is default for the microcontroller to set the mode to 0°C~85°C.There is a flash size 128MB on the MCU electronics.In this case, the connector type is B2B.There are two versions of this microcontrollers in the TE0803 Series.This is done to make sure that the software is able to run normally and that the RAM size is reduced to 2GB.
    TE0803-03-2BE11-A Features
    Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E
    Flash size of 128MB

    TE0803-03-2BE11-A Applications
    There are a lot of Trenz Electronic GmbH
    TE0803-03-2BE11-A Microcontroller, Microprocessor, FPGA Modules applications.

    Industrial Control
    Process Control
    Process Monitoring
    Healthcare Monitoring
    Patient Monitoring
    IoT Secure Gateways
    Human Machine Interface
    Human Machine Control Panel
    Home and Building Automation
    Thermostat
    Factory Lead Time12 Weeks
    Operating Temperature0°C~85°C
    SeriesTE0803
    Size / Dimension2.05 x 2.99 52mmx76mm
    Part StatusActive
    Moisture Sensitivity Level (MSL)Not Applicable
    Connector TypeB2B
    RAM Size2GB
    Core ProcessorZynq UltraScale+ XCZU2EG-1SFVC784E
    Module/Board TypeMPU Core
    Flash Size128MB
    
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