TE0803-03-3AE11-A Overview
A MPU Core module or board is used in the microcontroller.It has Zynq UltraScale+ XCZU2CG-1SFVC784E cores and is driven by a processor.Microcontrollers are configured by default to 0°C~85°C.MCU chips flash size is 128MB.B2B' stands for connector type.This MCUs belongs to the TE0803 Series of MCUs.A minimum RAM size of 2GB is set to enable the software to run normally.
TE0803-03-3AE11-A Features
Core processor of Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash size of 128MB

TE0803-03-3AE11-A Applications
There are a lot of Trenz Electronic GmbH
TE0803-03-3AE11-A Microcontroller, Microprocessor, FPGA Modules applications.

Test and Measurement
Medical Devices
Data Acquisition
Industrial Control
Process Control
Process Monitoring
Healthcare Monitoring
Patient Monitoring
IoT Secure Gateways
Human Machine Interface

Factory Lead Time	12 Weeks
Operating Temperature	0°C~85°C
Series	TE0803
Size / Dimension	2.05 x 2.99 52mmx76mm
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Connector Type	B2B
RAM Size	2GB
Core Processor	Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type	MPU Core
Flash Size	128MB