LS1023ASE8MNLB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 780-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 64-Bit. Recognize operating temperatures around 0°C~105°C. The cpu microprocessor belongs to the QorIQ® Layerscape series. The CPU is cored with a ARM® Cortex®-A53 processor. The CPU uses DDR3L, DDR4 RAM controllers.
LS1023ASE8MNLB Features
ARM® Cortex®-A53 Core

LS1023ASE8MNLB Applications
There are a lot of NXP USA Inc.
LS1023ASE8MNLB Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	18 Weeks
Package / Case	780-FBGA, FCBGA
Operating Temperature	0°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.2GHz
Core Processor	ARM® Cortex®-A53
Ethernet	1GbE (7) or 10GbE (1) & 1GbE (5)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR3L, DDR4
USB	USB 3.0 (2) + PHY
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
RoHS Status	ROHS3 Compliant